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Research Article |

Acoustic Noise Mitigation in Slip Angle Controlled DTC of Open-End Winding Induction Motor Drive Using Dual Randomized AISPWM for EV Application

Author(s): Ganesh Challa* and Dr. M. Damodar Reddy

Published In : International Journal of Electrical and Electronics Research (IJEER)        Volume 12, Special Issue on ETEVS

Publisher : FOREX Publication

Published : 30 September 2024

e-ISSN : 2347-470X

Page(s) : 19-24

DOI: https://doi.org/10.37391/ijeer.12et-evs04

Abstract

Low vibration and acoustical noise as well as effective DC link usage are the demands of industries and Electric Vehicles (EV). Direct Torque Control (DTC) of Induction Motors (IMs) meet the EV and other modern industry requirements. Still, flux as well as torque swings lead to higher acoustical noise. Consequently, EVs as well as working place noise have become major concerns, affecting the health of individuals. Efficiency of dc link use is improved by Space Vector Pulse Width Modulation (SVPWM). Yet, SVPWM is not efficient in lowering acoustical noise. Different RPWM techniques can lower acoustic noise. Still, the lower degree of randomisation makes the noise reduction difficult. This work presents a Hybrid Dual Random PWMs (HDRPWMs) based Alternate Inverter Switching (AIS) strategy for Slip-Angle Controlled Direct Torque Control of an Open End Winding IM Drive (OEWIMD). This technique is aimed to lower the acoustical noise for EVs. The intended PWMs seek to show how well HDRRPWMs distribute the acoustical noise spectra in contrast to conventional techniques.

Keywords: Acoustical Noise, RPWM.




Ganesh Challa*, Research Scholar, Department of EEE, S. V. University, Tirupati; Email: ganesh.challa@gmail.com

Dr. M. Damodar Reddy, Professor, Department of EEE, S. V. University, Tirupati; Email: mdreddy999@rediffmail.com

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Ganesh Challa and Dr. M. Damodar Reddy (2024), Acoustic Noise Mitigation in Slip Angle Controlled DTC of Open-End Winding Induction Motor Drive Using Dual Randomized AISPWM for EV Application. IJEER 12(ETEVS), 19-24. DOI: 10.37391/ijeer.12et-evs04.